CanaryTec Co., Ltd

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Microwave Dielectric Ceramic


-- Heat Sink / Chip Carrier / Solder


--Application
⊙ Adjust vertically, matching the Coefficient of Thermal Expansion.

--Features
⊙ Small size, Good Solderability and Bonding.

--Base Material Parameters
Classify	Code	Base Material Item	Density	CTE	Thermal Conductivity	Hardness
Classify	Code	Base Material Item	g/cm3	PPM/℃	W/mK	Hardness
Ceramic	B	99.6% AL2O3	3.90	7.5	29.3	* 83 GPa
	D	99.0% ALN	3.33	4.6	170	* 73 GPa
	F	99.5% BeO	2.85	6.8	270	* 82 Gpa
Metal	P	W80:Cu20	15.15	8.3	200	220 HB
	Q	W85:Cu15	15.90	7.3	190	240 HB
	R	Mo80%:20%	9.96	7.6	204	174 HB
	S	Mo85%:15%	10.01	7.0	195	156 HB
	T	CMC 13:74:13	9.88	5.6	200	——
	U	OFC TU1/TU2	8.90	16.7	397	102 HB
	V	Kovar 4J29	8.30	5.3	17	155 HB
	W	Au80%:Sn20%	14.5	16	57	276 HB
【*】The ROCKWELL 45 N method test.

--Type, Size and Au layer thickness

		C Type		D Type

Classify		Ceramic		Metal
Long & Width-inch (mm)		＞0.020" (0.50)		0.008" (0.20)~0.8"(20.0)
Thickness-inch (mm)		0.005"(0.127), 0.010"(0.254), 0.015"(0.381), 0.020"(0.508), 0.025"(0.635)		0.006"(0.15)，0.008"(0.20), 0.012"(0.30), 0.016"(0.40), 0.020"(0.50), 0.0315"(0.80), 0.040"(1.0), 0.0472"(1.2)
Au layer thickness-inch (um)		＞0.0001" (2.54)		＞ 0.00005"(1.30)

--Typical Products
No.	Code No.		Technical Data
1	M080080B10D		--99.6% AL2O3, D Type, Size: 0.80×0.80×0.254 mm.
2	M320300D10D		--99.0% ALN, D Type, Size: 3.20×3.00×0.254 mm.
3	M300100F10D		--99.5% BeO, D Type, Size: 3.00×1.00×0.254 mm.
4	M320160P08C		--W80%:Cu20% , C Type, Size: 3.20×1.60×0.20 mm.
5	M210200R06C		--Mo80%:Cu20%, C Type, Size: 2.10×2.00×0.15 mm;.
6	M150120V08C		--Kovar 4J29, C Type, Size: 1.50×1.20×0.20 mm.