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No.

Test Item Standards & Condition
1 Physical Dimension Mil-STD-883G£¬method 2016
2 Visual Inspection 100% visual inspection to meet or exceed Mil-STD-883G£¬method 2032 requirements
3 Conductor Thickness Conductor thickness to meet or exceed the customer requirements
4 Film Adhesion ASTM B571-97 £¨Film adhesion use 3M #610 tape£©
5 High Temp. Resistance All general thin film products must be met customer's requirements at 400¡æ for 10 mintues
6 Wire Bond Strength Mil-STD-883G£¬method 2011
7 Die Shear Strength Mil-STD-883G£¬method 2019
8 Wire Bond Shear Strength EIA/JESD22-B116
9 Thermal Shock Mil-STD-883G£¬method 2011, condition C
10 Customization Customer requirements of product quality testing are availible
 
 
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