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Microwave Dielectric Ceramic
Dielectric Ceramic Substrate
Dielectric Ceramic Resonator
Microwave Ferrite Substrate
Microwave Part
Single Layer Capacitor
Microwave Chip Resistor
Heat Sink / Carrier / Solder
Microwave Power Resistor
Microwave Component
AuSu Alloys Solder Foil
Submount / Standoff
New Product
               
--Microwave Chip Resistor        
 
               
--Application
  Microwave Integrated Circuit (MIC), Amplifiers, Couplers, Attenuators, and Filter.
               
--Features
  Good Solderability and Bonding, Small size.
               
--Parameters
  Operating Frequency Power Material TCC RES Min Size

PAD Min Size

STD T
  ~ 40 GHz 0.2 ~ 1.0 W TaN 100 PPM/

0.002"*0.002"

0.004"*0.004"

0.010"

  NoteThin Film, Au Layer Thickness Min 150 Microinch Suitable for the bonding process.
               
--Standard Product
  Resistance range \ Size \ Tolerance 0.02"*0.01" (0.51*0.25mm) 0.04"*0.02" (1.02*0.51mm) 0.06"*0.03" (1.52*0.76mm)
  J(5%) K(10%) J(5%) K(10%) J(5%) K(10%)
  50 Ohm R0201B500J R0201B500K R0402B500J R0402B500K R0603B500J R0603B500K
  100 Ohm R0201B101J R0201B101K R0402B101J R0402B101K R0603B101J R0603B101K
  200 Ohm R0201B201J R0201B201K R0402B201J R0402B201K R0603B201J R0603B201K
               
--Customization Product Parameters
  No. Item Option
  1 Material --AL2O3, ALN, BeO
  2 L * W --0.15"*0.15" (0.381*0.381mm)
  3 T --0.010"(0.254mm), 0.015"(0.381mm)
  4 Square Resistance --20, 30, 50, 75, 100 Ohm/Square
  5 Mode --Cascade, Parallel, or Both
  6 Resistor Quantity --1~ 30
               
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