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Microwave Dielectric Ceramic
Dielectric Ceramic Substrate
Alumina (AL2O3)
Alumina Nitrid (ALN)
Beryllium Oxide (BeO)
Microwave Ceramic
Ceramic Substrate for SLC
Fused Silica Quartz
Composite Dielectric Substrates
Dielectric Ceramic Resonator
Microwave Ferrite Substrate
Microwave Part
Microwave Component
AuSu Alloys Solder Foil
Submount / Standoff
New Product
--Fused Silica Substrate        
 
   
--Application
  Thin Film
               
--Features
  High insulation performance, Good mechanical strength.
               
--Material Characteristics Table
  Item Unit Fused Silica Microcrystalline Glass
  Chemical Formula SiO2 SiO2
  Purity % 99.999 98.0~99.2
  Density g/cm3 2.20 2.39
  Water Absorptivity % 0 0
  Surface Roughness Ra m 0.010 0.012
  Color Colorless, Transparent White, Translucent
  Flexural Strength 25 MPa 80 75
  Warping Degree 25 mm/25.4mm 0.08~0.12 0.05
  Thermal Conductivity 25 W/mK 1.46 1.60
  Coefficient of Expansion 20~320 110e-6/ 5.50 1.00
  Dielectric Strength DC,KV/mm 15.0 10.0
  Dielectric Constant 20, 1MHz 3.83 5.76
  Dielectric Loss 20, 1MHz 0.000015 0.000030
  Bulk Resistivity 25 cm 3.010e+14 2.010e+14
  Crystal Form Amorphous State Crystalline State
--Size Choice
  Code Type T-inch (mm) L & W-inch (mm) T Tolerance Application
  H Fused Silica 0.010 (0.254) 2.0*2.0 (50.8*50.8) 5.0% Thick Flim
0.015 (0.381) 3.0*3.0 (76.2*76.2)
0.020 (0.508)  
0.025 (0.635)  
  I Microcrystalline Glass 0.010 (0.254) 2.0*2.0 (50.8*50.8) 5.0% Thin Film
0.015 (0.381) 3.0*3.0 (76.2*76.2)
0.020 (0.508)  
0.025 (0.635)  
                 
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