Home |  About Us  |  Products  |  Test  |  Quality  |  Support  |  Contact Us
Microwave Dielectric Ceramic
Dielectric Ceramic Substrate
Dielectric Ceramic Resonator
Microwave Ferrite Substrate
Microwave Part
Microwave Component
AuSu Alloys Solder Foil
Submount / Standoff
New Product
       
---HTCC / LTCC  
 
       
--Ceramic Tape Parameter
  Item Parameter Typical Value
  Material 96% AL2O3 or 99.0% ALN !!
  Ceramic Tape Thickness 0.004"~0.025" (0.102~0.635mm) 0.010" (0.254mm)
  Length & Width Precision 次 5.0% !!
  Thickness Precision 次 10.0% !!
  Flatness Precision 0.005 inch / inch !!
       
--Package Size Parameter
  Item Parameter Typical Value
  Package Length & Width (maximum) +1.5" (38.1mm) 1.0" (25.4mm)
  Package Thickness 0.040"~ 0.100" (1.01~2.54mm) !!
  Number of Layers 10 5
  Layer Thickness (As Fired) 0.008"~0.020" (0.203~0.508mm) 0.0100" (0.254mm)
  Layer Thickness 次10% !!
       
--Via Design Parameter
  Item Parameter Typical Value
  Number of Via 1000 !!
  Via Diameter 0.004 "~0.020 " (0.10~0.50mm) 0.010 " (0.25mm)
  Position accuracy 0.0004 " (0.01mm) !!
  Layer Thickness to Via Diameter Aspect Ratio 0.4 !!
  Via-to-Via Centerline Distance (Pitch) 2.5* Via Diameter !!
       
=DBC( Birect Bond Copper )  
 
       
=Ceramic Packages  
 
       
 
       
 
       
 
       
Home |  About Us  |  Product  |  Test Quality  |  Support  |  Contact Us
©Copyright 2014, All rights reserved. CanaryTec Co., Ltd. ーYue ICP No.10211134―