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---HTCC / LTCC： |
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--Ceramic Tape Parameter |
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Item |
Parameter |
Typical Value |
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Material |
96% AL2O3 or 99.0% ALN |
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Ceramic Tape Thickness |
0.004"~0.025" (0.102~0.635mm) |
0.010" (0.254mm) |
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Length & Width Precision |
＜± 5.0% |
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Thickness Precision |
＜± 10.0% |
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Flatness Precision |
＜ 0.005 inch / inch |
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--Package Size Parameter |
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Item |
Parameter |
Typical Value |
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Package Length & Width (maximum) |
≤1.5" (38.1mm) |
1.0" (25.4mm) |
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Package Thickness |
0.040"~ 0.100" (1.01~2.54mm) |
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Number of Layers |
＞10 |
5 |
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Layer Thickness (As Fired) |
0.008"~0.020" (0.203~0.508mm) |
0.0100" (0.254mm) |
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Layer Thickness |
＜±10% |
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--Via Design Parameter |
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Item |
Parameter |
Typical Value |
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Number of Via |
＜1000 |
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Via Diameter |
0.004 "~0.020 " (0.10~0.50mm) |
0.010 " (0.25mm) |
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Position accuracy |
＜0.0004 " (0.01mm) |
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Layer Thickness to Via Diameter Aspect Ratio |
＞0.4 |
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Via-to-Via Centerline Distance (Pitch) |
＞2.5* Via Diameter |
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=DBC( Birect Bond Copper ) |
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=Ceramic Packages |
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